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The technology Molded Interconnect Device (MID) offers high potential for the development of innovative product solutions. The integration of electronic and mechanical functions on spatial circuit boards allows the realization of modules with high functional density, freedom of design and a significant degree of miniaturization. However, due to the interdisciplinary nature of the technology the potentials...
Molded Interconnect Devices (MID) are three-dimensional structures with integrated electronic circuit traces that facilitate the miniaturization and functional integration of technical products. This opens up new possibilities for the conception and design of products but also comes with specific challenges. The complexity of MIDs has a major influence on the design process of the product and the...
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