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We investigated bias temperature instability (BTI) and time dependent dielectric breakdown (TDDB) in TaCx/HfSiON MOSFETs in terms of the effects of TaCx metal gate electrode, using various Ta composition and TaCx thickness. We find a dual nature of TaCx metal gate electrode effects on the reliability. The gate electrode has both positive and negative influence on BTI and TDDB. Though various TaCx...
We have clarified the impact on reliability of La incorporation into the HfSiON gate dielectrics nMOSFETs (PBTI, TDDB). Although La incorporation is effective for pre-existing defect suppression, stress induced defect generation is more sensitive to stress voltage and temperature. This is caused by the elevation of the energy level of oxygen vacancy and high ionicity of La-O bond. The origin of defects...
We have investigated the time dependent dielectric breakdown (TDDB) characteristics for a high-k/metal gate pMOSFET under inversion stress. We found that electrons, injected from the cathode, being minority carriers in the gate leakage current play an important role in determining TDDB lifetime and found that the presence of oxygen vacancies in HfSiON determine the electron current mechanism in HfSiON...
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