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The use of low-k materials is essential for improving the quality of integrated circuits. Subsequent process steps may however modify this film to the extent that the final result is unacceptable. Organosilicate-based low-k films, with a nominal k-value of 2.3, were exposed to different post-CMP cleaning plasmas used for copper reduction. The resulting plasma damage was investigated and is reported...
The use of cochlear implants is an efficient treatment for profound hearing loss in adults and children. In order to reduce the traumatic impact during the implantation new electrode designs are required. This work presents a multi-electrode polymeric flat carrier to be implanted on the lateral wall of the cochlea to provide communication with an implanted electrical receiver-stimulator.
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