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We propose a new, large-scale, logic TEG, which is called flip-flop RAM (FF-RAM), to improve the total process quality before and during initial mass production. It is designed to be as convenient as an SRAM for measurement and imitates a logic LSI. We implemented a 10-Mgate FF-RAM using our 65 nm CMOS process. The test results show that it is effortless to detect failure locations and layers by using...
We propose a new design scheme to improve the SRAM read and write operation margins in the presence of a large Vth variability. By applying this scheme to a 0.494 mum2 SRAM cell with a beta ratio of 1, which is an aggressively small cell size, we can achieve a high-yield 8M-SRAM for a wide range of Vth value using a 65 nm LSTP CMOS technology
An embedded DRAM macro in a logic compatible 90nm CMOS process is designed with low-noise core architecture and high-accuracy post-fabrication tuning. With a 5fF/cell capacitance, a 61% improvement of sensing accuracy enables 322MHz random-cycle operation and reduces data retention power to 60 /spl mu/W.
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