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Fluxless bonding between large silicon (Si) chips and copper (Cu) substrates using electroplated indium (In) and silver (Ag) as solders has been successfully developed. The nucleation mechanism in In-Ag system is first studied. It is interesting to discover that In reacts with underlying Ag and forms Agln2 as soon as it is electroplated at room temperature. To reduce stress caused by coefficient of...
A Cahn–Hilliard evolution equation possessing a source term is employed to study the morphological evolution of a strained heteroepitaxial thin film, during continuous mass deposition, on a substrate with an embedded coherent island. The elastic properties and the surface energy are anisotropic, with the surface energy anisotropy being strong enough to result in missing orientations and facets. A...
The effects of external stresses on ferroelectric properties of Pb(Zr,Ti)O 3 thin film capacitors were studied with a phenomenological Landau–Khalatnikov equation. In this simulation, Landau free energy density functional (G) considering the interaction between ferroelectric polarization (P) and external stresses (σ) was used; G ̂=a1P2+a11P4+a111P6−Q′12(σ12+σ22)P2−EP. As reported experimentally,...
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