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The use of non-conductive paste (NCP) or film (NCF) adhesives to replace the ACF (anisotropic conductive film) in COG (chip on glass) packages may be a possible solution for the low cost and finer bump pitch application to the LCDs (liquid crystal displays). However, when the NCP is applied, reliability issues, such as excessive warpage, interfacial delamination, and increasing contact resistance...
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