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This paper studies hot spot and thermal coupling problems in future multicore architectures as CMOS technology scales from 65 nm feature size to 15 nm. We demonstrate that the thermal coupling between neighboring cores will dramatically increase as the technology scales to smaller feature sizes. The simulation studies were based on solving the heat equation using the analytical Green's function method...
The Advanced Telecommunications Computing Architecture (ATCA) standard describes a powerful platform, implementation of which is considered to be adopted as a base for the control system of the X-ray Free Electron Laser (X-FEL), being built at Deutsches Electronen-Synchrotron (DESY) in Hamburg, Germany. The Low Level Radio Frequency (LLRF) control system is composed of a few ATCA Carrier Boards. Each...
This paper discusses the possibility of estimating in real time internal heat source temperature values based on the sensor measurements available only at circuit boundaries. The chances and some fundamental limitations of such a boundary temperature scan approach are illustrated based on an example of a test ASIC. This circuit contains a matrix of heat sources which can be individually switched on/off...
This paper presents measurements and simulations of a test integrated circuit. The circuit contains a matrix of heat sources and a set of temperature sensors, what renders possible measurement of circuit temperature in real cooling conditions inside a closed package. The measurements are validated for different patterns of power dissipation and cooling conditions with numerical simulations. Based...
This paper presents thermal analyses of a power amplifier placed in a wind tunnel. All the investigations are based on the transient temperature measurements performed during the circuit cooling process. The measured cooling curves were used to compute the cumulative and differential structure functions for the circuit with a heat sink. These functions helped to determine the optimal values of circuit...
One of the most commonly employed methods of electronic circuit temperature measurement is the infrared thermography. This method requires direct access to the structure surface thus, in order to perform measurements, openings must be made in the circuit package. This, in turn, changes cooling conditions and consequently circuit temperature. This work presents the problem on a practical example where...
In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several...
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