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This paper discusses the problem of determining a thermal model of an electronic system based on the spectral analysis of its step temperature response. The proposed method yields equivalent RC Cauer ladder thermal models, which consist of only a few RC stages, but produce very accurate estimates of circuit temperature. Moreover, the values of model elements have physical significance. Such a thermal...
This paper presents the design and the practical realization of a measurement system dedicated to fast real-time multichannel registration of electronic system thermal response. The response is registered in parallel channels with a frequency up to 1 MHz. Such a high frequency is required for the thermal identification of electronic systems. The designed circuit is used here for the investigation...
This paper presents simulations and measurements of an integrated PTAT sensor. The sensor is equipped with an overheat protection circuit and was implemented in an ASIC containing matrices of heat sources and junction temperature sensors. The PTAT sensor is used for temperature monitoring and it is responsible for issuing warning signals in a case of chip overheat. Particular attention is paid to...
In this paper, a three-dimensional (3D) thermal simulations of basic integrated circuit (IC) components are presented. The layout of the real application specific integrated circuit (ASIC) generated in CAD CADENCE software were loaded into the CFD-ACE environment, where the 3D thermal simulation was done. The influence of many heating points was considered in simulations. Comparison among several...
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