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This paper discusses the problem of determining a thermal model of an electronic system based on the spectral analysis of its step temperature response. The proposed method yields equivalent RC Cauer ladder thermal models, which consist of only a few RC stages, but produce very accurate estimates of circuit temperature. Moreover, the values of model elements have physical significance. Such a thermal...
Thermoreflectance microscopy is a well established method for the thermal imaging of (opto)electronic components and ICs. The technique combines submicron spatial resolution with excellent temperature resolution (10mK can be achieved). The dynamic thermal behavior can be studied using either a transient pulsed boxcar or frequency domain approach, the latter including homodyne and heterodyne lock-in...
The aim of this report is to investigate the influence of changing the ambient temperature on behavior of simple and cascode current mirror. Moreover we'll investigate the influence of changing the temperature of each of the transistors separately with different temperature gradient configurations.
This paper investigates the possibility of assessing the die attach quality by the spectral analysis of the recorded device time response. The conducted analyses of the measured and the simulated time constant spectra of the thermal response allowed the explanation of the anomalous electrical oscillations observed during the operation of a power converter.
This paper illustrates how the information obtained from dynamic thermal measurements can be used directly for the determination of certain unknown thermal data necessary for simulation purposes. Experimental heating curves of a hybrid power amplifier are processed further to compute the time constant spectra of the thermal responses and to construct their corresponding structure functions. From these...
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