The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
The purpose of this paper is to discuss the effect of Nickel (Ni) thickness on lead free solder joint material for tape ball grid array (TBGA) application. In this study, four different level of Nickel thickness were chose that is 3 um, 4 um, 5 um and 6 um. Ball pull testing was used to assess the solder joint performance at time zero, after multiple reflow and high temperature storage (HTS). The...
As the world is changing to Pb-free solder per EU ROHS Directive, the higher reflow temperature requirement for Pb- free solder has demanded better substrate metal trace to solder mask adhesion to prevent delamination problem. Hence, selective Ni/Au plating process becomes more appealing in the fabrication of substrates to support Pb-free Semiconductor BGA product packaging. However, the set back...
In this work, Sn3.5Ag solder alloy was being studied for the purpose of Pb-free solder joint reliability improvement over conventional Sn3.8AgO.7Cu solder balls on Ball Grid Array (BGA) packages with Ni/Au pad finishing. The study was carried out in different levels. At individual solder joint level, Sn3.5Ag showed no intermetallic brittle failure in cold ball pull test even up to 6times multiple...
This paper discusses on the effect of number of zincation in electroless nickel immersion gold (ENIG) under bump metallurgy (UBM) on reliability in microelectronics packaging. Double and triple zincation of ENIG methods were used as comparison study. The effect of number of zincation to surface roughness and surface morphology were investigated. All samples were subjected to reliability tests such...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.