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SAC305 solder paste is commonly used electronic assembly. This solder alloy consists of 96.5% tin, 3% silver, and 0.5% copper and melts at 219 °C. The peak reflow temperature range is typically 240 - 260 °C. With electronic devices such as smartphones, notebook PCs, and tablets becoming thinner, packaging substrates, such as ultra-thin flip chip ball grid arrays (FCBAs), and the printed circuit boards...
The crystal-face dependence of the dye-sensitized photocurrents and the adsorption properties of benzothiazole merocyanine (Mc[18,1]) dye molecules were investigated, using atomically flat (100) and (110) TiO 2 single crystal surfaces. From the estimation of the amount of the transferred charge from the TiO 2 surface to CO groups of dye molecules based on NEXAFS data, it was revealed...
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