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Laser grooving process is crucial to thin chip strength. Much of paper has been put on the mechanism of laser grooving, but only few investigations were taken for chip strength enhancement. In this paper, thin chip (less than 100um chip thickness) is adopted, and the experiment of laser grooving process is carried out for mechanical characteristics evaluation. Based on experiment results, the optimal...
The high level of reliability experienced by power transformers has led to the situation that a large number of aged units are still operating in the power systems. However, uncertainty on how transformers behave when aged causes concerns over the existence of possible hidden failure modes, which have yet to be revealed by failure data. In order to establish whether aged transformers are able to maintain...
The effect of early failure model on upstream EM reliability and its improvements are investigated in a 45nm CMOS process. The effective process optimizations of tapered via profile by organic under layer (ODL) over etch (OE) at chamfer area and enlarged trench CD have been analyzed and discussed. Recent observations shown tapered via profile at chamfer area can get much larger angle for barrier seed...
Power transformers are considered to be one of the most critical components of a power system. Due to ageing the majority of transformer populations are at or approaching their anticipated design lives, causing growing concerns over possible consequential impacts to system reliability. It is essential for utilities to maintain high levels of system reliability and ensure the continued cost-effectiveness...
The reliability of circuits (wiring and vias) under bond pads has been studied for both Au wire bonding and Cu wire bonding, for bond pads and wiring levels typical of those used in RF technology. Electrical test structures under bond pads were used to characterize wire and via integrity after wire bonding and reliability stresses. In addition, SEM analysis was used to inspect for possible damage...
In this paper, we have discussed three intrinsic reliability issues of thin-film -Si:H solar cells; space charge limited shunt conduction through localized metal-semiconductor-metal structures; shadow degradation in series connected cells in a module, and light induced degradation. Despite their distinct external manifestation, these intrinsic reliability issues appear to share common physical phenomena...
Safety stock is one of the important parts of logistics management in ERP. This paper attempts to use artificial neural networks to forecast safety stock. Based on the index system of safety stock, this paper constructs a three-level BP neural network to analyze the principle and model of safety inventory. By using the samples to train and inspect the BP neural network, we conclude that the application...
For the first time we report on the development of a novel hafnium zirconate (HfZrOx) gate dielectric with a TaxCy metal gate. Compared to HfO2, the new HfZrOx gate dielectric showed: (1) higher transconductance, (2) less charge trapping, (3) higher drive current, (4) lower NMOS Vt, (5) reduced C-V hysteresis, (6) lower interface state density, (7) superior wafer-level thickness uniformity, and (8)...
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