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Induction heating reflow method, which can achieve the solder bumping and interconnecting process in a simple way, was studied to control the height and shape of solder interconnects employed in electronic packaging application. A solder joint model was built to investigate the temperature distribution in the joint during the whole induction heating process by ANSYS software. Based on the simulation,...
Cu pillar bump with eutectic SnPb was annealed and the micro structures were observed by scanning electron microscopy. Both of Cu6Sn5 and Cu3Sn grew following parabolic rate law at 120 and 150degC. At 165degC, Cu6Sn5 growth was stagnated while Cu3Sn growth rate was increased after 160 hour when all Sn was consumed. Kirkendall void was formed because of different diffusivities of Cu and Sn. The activation...
A fluxless process of bonding silicon to Ag-cladded copper using electroplated In-Ag multilayer structure is developed. The Ag cladding on the copper substrate is a stress buffer to deal with the large mismatch in coefficient of thermal expansion (CTE) between semiconductors such as Si (3 ppm/degC) and Cu (17 ppm/degC). To manufacture Ag on copper substrate, two techniques are developed. The first...
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