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The application of electronic devices in harsh environments, such as automotive environment, necessitates that packaging material meet stringent reliability requirements. Underfills not only need to redistribute thermomechanical stress across solder joints, but also should be sufficiently toughened in order to resist crack propagations due to mechanical vibrations and thermomechanical stress expected...
We report a surface modification method to improve the filler-matrix interface in silica-epoxy composites. A double-layer modification scheme was used to coat silica with polysiloxane-based surface modifier molecules. The polysiloxane coating reaction was confirmed by SEM, DSC, and TGA analyses, and the coated silica exhibit good chemical compatibility with the epoxy matrix. The CTE of epoxy composite...
We report a novel surface modification method to improve the interfacial bonding and compatibility of nanosilica with epoxy matrix. This approach utilized a two-layer modification strategy that not only provides a layer of functional groups at the surface to match the surface energy of nanosilica with epoxy resin, but also generates a large filler-matrix interphase transition region by covalent bonding...
The reliability is an important issue for IC devices. Since moisture, mobile ions, ultraviolet, and other hostile environment will affect the device performance and lifetime. In our study, a robust conformal superhydrophobic (SH) coating will be applied to improve the reliability of the device. SH epoxy/nano silica composites were spin-coated on triple track resistors (TTR). An O2 plasma treatment...
Advanced underfill material plays an important role in device reliability by distributing the thermal stress and providing environmental protection. Recently there is an increasing demand for low stress underfill which requires low coefficient of thermal expansion (CTE), low modulus and good flowablity. In this report, polyhedral oligomeric silsesquioxanes (POSS) functionalized with epoxy groups are...
SiC particles and epoxy resin were applied to prepare a potential high thermal conductivity underfill material. SiC particles are thermally coated with a nano layer silica by oxidation at high temperature. Then silane was used as the surface treatment of the silica coated SiC particles to improve the interaction between filler and polymer matrix. TEM and TGA measurements were used to characterize...
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