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Anisotropic conductive adhesives (ACAs) have been considered as one of promising interconnect materials for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA joints have been a bottleneck to deploy ACAs in high power devices. In this study, we introduced conjugated dithiols into ACA formulations to construct the molecular wire junction...
Highly conductive anisotropic conductive films (ACFs) with in-situ reduced silver nanoparticles as fillers were developed. During the preparation of ACF formulation, the silver nanoparticles were reduced by the hydroxyl groups from the phenoxy resin through the polyol process. Due to the capping effects of the epoxy resin, the in-situ reduced silver nanoparticles were well dispersed in the polymer...
Summary form only given. Although conductive adhesives have been studied for many years as a lead-free for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration, hi this study, a novel approach to reduce silver migration and enhance the...
Electrically conductive adhesives (ECAs) are a promising alternative for lead-containing solders in electronic packaging. However, the conductivity of ECA is lower than that of solders due to the physical contact between conductive fillers and insulative organic lubricants on Ag flakes. In this study, a group of reducing agents were introduced into a typical ECA formulation. During the curing process,...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
Electrical properties of the isotropic conductive adhesives filled with micron sized silver flakes and nanosized silver particles were investigated. By using appropriate surfactants, the resistivity of the silver flakes and silver nanoparticles incorporated conductive adhesives was dramatically reduced to as low as 5 times 10-6 Omega.cm. Morphology studies showed that the decreased resistivity resulted...
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