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Anisotropic conductive adhesives (ACAs) have been considered a promising interconnect material for next generation high performance devices. However, high joint resistance and low current carrying capability of ACA interconnects have been the limitations to utilizing ACAs in high power devices. In this study, we have introduced conjugated dithiols into ACA formulations to create molecular wire junctions...
Summary form only given. Although conductive adhesives have been studied for many years as a lead-free for electronic interconnect are limited to low voltage display driver devices. This is due to the serious concerns associated with the long-term reliability and high voltage application issues caused by the silver migration, hi this study, a novel approach to reduce silver migration and enhance the...
Recently, non-conductive adhesive (NCA) bonding technology has attracted increasingly research interests as lead-free interconnect due to the fine pitch capability and low cost. The NCA usually requires no conductive tillers, but needs a relatively high pressure for bonding between the IC chip and the substrate coupled with heat. During bonding, the heat and pressure are applied for some time and...
Recently, anisotropic conductive adhesives (ACAs) have attracted increasing interests as environmentally friendly materials in electronic packaging industry because they are lead-free, require fewer processing steps, such as fluxing and cleaning (reducing processing cost), allow a low processing temperature (enabling the use of heat-sensitive and low-cost components and substrates), and fine pitch...
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