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Buildup PWB (Printed Wiring Boards) for semiconductor package is widely used which is laminated the buildup materials onto the core materials (high Tg FR4, FR5 or BT). Generally, epoxy based buildup materials is used without glass cloth for the package of ASIC's(Application Specific Integrated Circuits), CPU's, GPU's, and other IC's that require large numbers of I/O(input/output) circuits because...
A new No Clean Flux (NCFx) material for large die packages was formulated, which has good wettability for area array lead-free solder bumps of 20 × 20 mm dies, and which doesn't leave any liquid residues under the die. In a reliability study on large die modules with a copper lid as a heat spreader, we confirmed no failures of electrical insulation during thermal and humidity tests. However, significant...
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