The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
For solder joints subjected to current stressing, the formation of a pancake-type void in the solder and excessive consumption of the metallization layer are the two major degradation mechanisms reported in the literature. Nevertheless, the key factor determining which mechanism is dominant and responsible for failures remains unidentified. This paper describes a theoretical analysis and the ensuing...
Ball impact test and ball shear test have been used to investigate the joint strength. The joint strength of lead and lead-free solder joints under high strain rate condition were examined. Microstructure in the as-reflowed condition and fracture surfaces were investigated. The intermetallic compounds of Sn-3Ag-0.5Cu joints demonstrated as layer-type (Cu, Ni)6Sn5. Fractographies show that all of Sn37Pb...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.