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Here a robust micro mechanical-latch shock switch is presented to record shock event for tens of G without slippage effect. Since the proposed shock switch is made of Ni, low contact resistance can be easily achieved to simplify sensing circuit. An analytical model with fixed-roller boundary condition is developed to investigate the effects of key dimensional parameters. The experimental results show...
Co films with various thicknesses were selectively deposited as Cu capping layers by chemical-vapor-deposition technique. Selectivity of the Co deposition between Cu and dielectric surfaces was improved by raising the deposition pressure. Degree of electromigration (EM) resistance enhancement was observed to be dependent on the deposited Co thickness. Compared to the no-Co control, significant EM...
Fundamental material interactions as pertinent to nano-scale copper interconnects were studied for CVD Co with a variety of micro-analytical techniques. Native Co oxide grew rapidly within a few hours (XPS). Incorporation of oxygen and carbon in the CVD Co films (by AES and SIMS) depended on underlying materials, such as Ta, TaN, or Ru. Copper film texture (by XRD) and agglomeration resistance (by...
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