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A custom SRAM was developed for high performance and high reliability network switching applications using 90 nm low-k silicon technology. It is a 13.6 mm x 18.4 mm flip chip chip scale package (CSP) with a 11.12 mm x 16.36 mm die. The package has 838 BGA balls at 0.5 mm pitch. The 0.5 mm ball pitch CSP minimizes electrical package parasitics and enables higher data rate performance. However, the...
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