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In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects...
Most studies on modeling cyclic thermo- mechanical fatigue of solder interconnects consider only the steady-state creep behavior of solder materials. This study explores the effect of including the primary creep behavior; since it may represent a significant portion of the total viscoplastic deformations in Pb-free Sn3.0Ag0.5Cu (SAC305) solder (G. Cuddalorepatta et al., 2007). The solder constitutive...
This study investigates the time dependent behavior of lead-free hypoeutectic Sn3.0Ag0.5Cu solder using a combination of experimentation and modeling. Experimental data for hypoeutectic Sn3.0Ag0.5Cu (SAC) is obtained from stress relaxation tests at different temperatures and different initial stress levels, and compared with the benchmark eutectic Sn37Pb, using a modified lap shear test. The test...
This paper presents a strain based fatigue model for Pb-free SAC (Sn3.9Ag0.7Cu) solder interconnects based on the results of a designed experiment. Testing consists of temperature cycling CLCC packages soldered to printed wiring board under a fixed 100degC temperature range with the mid-point temperature varying between 25 and 75degC. In addition, the dwell (hold) time at the maximum temperature is...
The thermal fatigue data of two Sn-based Pb-free solders (Sn95.4/Ag3.9/Cu0.7, Sn96.5/Ag3.5) are presented. The test vehicles (LCCC mounted on FR-4 PCB) are subjected to various thermal cycling conditions; a constant temperature excursion (T = 100degC) with different cyclic mean temperatures and dwell times. The results are compared with the results of Sn63/Pb37. The results show that the two Pb-free...
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