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In this paper, the impact of microfluidic cooling on the electrical characteristics of through-silicon vias (TSVs) is investigated for three-dimensional (3-D) integrated circuits (ICs). The design and fabrication of a testbed containing TSVs are presented for two types of heat sinks (micropin-fin and microchannel heat sinks) immersed in deionized (DI) water. The high-frequency characterization of...
This paper demonstrates the integration of microfluidic cooling for thermally limited 3-D microsystem applications. Thermal modeling of logic and memory dice on a silicon interposer is presented under air and microfluidic cooling conditions. Moreover, the electrical characteristics of micropin-fin-embedded through silicon vias (TSVs) immersed in deionized (DI) water are investigated through high-frequency...
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