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This work focuses on the mechanical behaviour of lead free solder alloys under high strain rate and thermal aging conditions. Tensile experiments have been accomplished using miniature specimens with a diameter of 1 mm to stay close to the dimensions of real solder joints. The specimens have been manufactured by a casting process. A controlled cool down process was applied having a cooling rate of...
3D packaging is one of the main emerging markets especially for mobile application within the last view years. Mobile devices are exposed and hence need to be reliable under to vibration or mechanical shock conditions. Therefore, material properties covering strain rate dependency have to be at hand within reliability studies. Miniature bulk specimens were utilized to gain stress and strain data at...
The scope of the paper is to present the result of the determination of mechanical material properties of a SAC based solder at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used to investigate the solder behaviour experimentally. Stress and strain data are recorded at high strain rates using a high resolution tensile test setup. Explicit FEM methodology...
The scope of the paper is to present the result of a characterisation methodology to determine solder mechanical material properties at high strain rates. Considering volume effects miniature bulk specimens with dimensions comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. To improve...
The scope of the paper is to present the result of combining experimental and simulation methodologies to determine mechanical material properties at high strain rates. Miniature bulk specimens which have a diameter comparable to BGA joints are used in the experiments. Stress-strain data recorded at high strain rates proof the high resolution capability of a novel tensile setup. A FEM model of the...
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