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Bias Temperature Instability (BTI) degradation and recovery with different types of MOL capping layers are investigated in a 20nm Replacement Metal Gate (RMG) CMOS technology. It is found that less compressive RMG capping layers substantially improve reliability and device performance because of less hydrogen within the RMG capping material. The hydrogen content plays an important role in BTI degradation...
A two step gate dielectric deposition technique on GaN, viz. thermal oxidation of Low Pressure Chemical Vapor Deposited (LPCVD) silicon is reported. Current-Voltage (I-V) and Capacitance-Voltage (C-V) characterization of the Metal Insulator Semiconductor (MIS) capacitors are carried out to assess the interface properties. MIS devices with thermal oxide show improved I-V characteristics compared to...
MIS capacitors on nitrided and non-nitrided Ge substrates with HfO2 as the dielectric have been studied. Effective oxide thickness is found to be reduced after nitridation. Significant improvements in the electrical characteristics are observed for the devices fabricated on nitrided substrates. The value of density of interface states is found to be lower for nitrided device when compared to non-nitrided...
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