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This study focuses on quasi-static mechanical cycling durability of copper traces on printed wiring assemblies (PWAs). PWA specimens populated with Land Grid Array (LGA) components on copper-defined pads were cycled to failure under zero-to-max, three-point bending. Failure is defined in terms of electrical opens due to fatigue damage propagation through the entire cross section of the trace. Failure...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar cells, has been studied and benchmarked against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure modeling. This paper reports the accelerated testing tasks and the modeling tasks are reported elsewhere in the literature. Accelerated thermal...
The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar laminates, has been studied and benchmarks against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure (PoF) modeling. Accelerated thermal cycling tests conducted on photovoltaic laminates of both solder compositions, show that the interconnect...
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