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The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar cells, has been studied and benchmarked against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure modeling. This paper reports the accelerated testing tasks and the modeling tasks are reported elsewhere in the literature. Accelerated thermal...
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