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This paper quantifies the effect of aging on the durability of printed wiring assemblies (PWAs) subjected to dynamic loading conditions. The test specimen is a FR4 board with a single 256 I/O, full grid, PBGA component at the center. The pad finish on the board and component side of the Sn37Pb eutectic solder interconnects is organic solderability preservative (OSP) and Sn15Pb, respectively. The test...
The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar cells, has been studied and benchmarked against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure modeling. This paper reports the accelerated testing tasks and the modeling tasks are reported elsewhere in the literature. Accelerated thermal...
This paper presents a strain based fatigue model for Pb-free SAC (Sn3.9Ag0.7Cu) solder interconnects based on the results of a designed experiment. Testing consists of temperature cycling CLCC packages soldered to printed wiring board under a fixed 100degC temperature range with the mid-point temperature varying between 25 and 75degC. In addition, the dwell (hold) time at the maximum temperature is...
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