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Electroplated Ni/Au over Cu is a popular metallization for printed circuit board (PCB) finish as well as for component leads, especially for wire-bondable high frequency packages, where the gold thickness requirement is high (≥ 20 µinches) for wire bonding. This study examines the effect of redeposition of bulk AuSn4 IMC as a function of varying gold content (2–5 nominal weight-%) in the solder joint...
In the conversion towards Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with an attractive, low temperature, processing. One such promising packaging concept is direct bonding of flip-chip dies onto printed wiring boards (PWBs), with adhesive bonds between a gold-bumped flip-chip IC and matching gold-plated copper pads...
In the conversion to Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with the added benefit of low temperature, processing (Lau et al., 2002). This paper explores the degradation mechanisms and kinetics in adhesively bonded Au-bumped flip chip interconnects. Earlier researchers have suggested that electrical contact is...
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