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This study focuses on assessing the effects of temperature on vibration durability of SAC305 PWAs under random vibration excitation on a repetitive shock (RS) shaker. Major complexities involved in quantifying random vibration response and durability data are first discussed through a comparison of specimen unimodal response under harmonic excitation versus multimodal response to random excitation...
In this paper, the vibration durability of SAC305 solder interconnects of Heat-sink Very-thin Quad Flat-pack No-leads (HVQFN) assemblies is investigated by accelerated stress testing and Physics-of-Failure (PoF) simulations, under various types of vibration excitation. In future work, these results will be used to develop PoF models for vibration fatigue durability of Pb-free SAC305 solder interconnects...
In this paper, durability tests were conducted on both SAC305 and Sn37Pb solder interconnects using both harmonic and random vibration. The test specimens consist of daisy-chained printed wiring boards (PWBs) with several different surface-mount component styles. Modal testing was first conducted on a test PWB to determine the natural frequencies and mode shapes. The PWB was then subjected to narrow-band...
When assessing the mechanical durability of electronic assemblies, the focus is generally on the solder interconnect. However, in many package styles, such as BGAs (ball grid arrays), LGAs (land grid arrays), MLFs (micro lead frame) and QFNs (quad flat no-lead), the Cu trace emanating from the solder pad may be the weakest failure site, especially if the solder joint is copper-defined rather than...
According to the European Directive 2002/95/EC RoHS solders that contain lead have to be replaced with lead-free equivalents. Replacing well-known materials with new materials not only force technological adaptations but also force necessity of reliability investigations, especially new failure modes. In case of lead-free solders, the main problem is reduction of solder joint strength. Lower strength...
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