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In the conversion towards Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with an attractive, low temperature, processing. One such promising packaging concept is direct bonding of flip-chip dies onto printed wiring boards (PWBs), with adhesive bonds between a gold-bumped flip-chip IC and matching gold-plated copper pads...
In this paper, durability tests were conducted on both SAC305 and Sn37Pb solder interconnects using both harmonic and random vibration. The test specimens consist of daisy-chained printed wiring boards (PWBs) with several different surface-mount component styles. Modal testing was first conducted on a test PWB to determine the natural frequencies and mode shapes. The PWB was then subjected to narrow-band...
In the conversion to Pb-free electronics, there has been increasing interest in conductive adhesive interconnects, as they combine Pb-free materials with the added benefit of low temperature, processing (Lau et al., 2002). This paper explores the degradation mechanisms and kinetics in adhesively bonded Au-bumped flip chip interconnects. Earlier researchers have suggested that electrical contact is...
According to the European Directive 2002/95/EC RoHS solders that contain lead have to be replaced with lead-free equivalents. Replacing well-known materials with new materials not only force technological adaptations but also force necessity of reliability investigations, especially new failure modes. In case of lead-free solders, the main problem is reduction of solder joint strength. Lower strength...
Most studies on modeling cyclic thermo- mechanical fatigue of solder interconnects consider only the steady-state creep behavior of solder materials. This study explores the effect of including the primary creep behavior; since it may represent a significant portion of the total viscoplastic deformations in Pb-free Sn3.0Ag0.5Cu (SAC305) solder (G. Cuddalorepatta et al., 2007). The solder constitutive...
This study presents simulation of damage initiation and propagation in solder joints with voids, under thermo-mechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the boundary conditions in a local model which focuses...
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