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The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar cells, has been studied and benchmarked against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure modeling. This paper reports the accelerated testing tasks and the modeling tasks are reported elsewhere in the literature. Accelerated thermal...
The thermal cycling durability of large-area Pb-free (Sn3.5Ag) solder interconnects on photovoltaic (PV) solar laminates, has been studied and benchmarks against existing Sn36Pb2Ag interconnects, using a combination of accelerated testing and physics-of-failure (PoF) modeling. Accelerated thermal cycling tests conducted on photovoltaic laminates of both solder compositions, show that the interconnect...
This study presents simulation of damage initiation and propagation in solder joints with voids, under thermo-mechanical loading. A three dimensional, global-local, visco-plastic FEA is conducted for a CTBAG132 assembly under thermal cycling. The displacement results of the global FEA at the top and bottom of the critical solder ball are used as the boundary conditions in a local model which focuses...
This paper presents a strain based fatigue model for Pb-free SAC (Sn3.9Ag0.7Cu) solder interconnects based on the results of a designed experiment. Testing consists of temperature cycling CLCC packages soldered to printed wiring board under a fixed 100degC temperature range with the mid-point temperature varying between 25 and 75degC. In addition, the dwell (hold) time at the maximum temperature is...
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