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Failures under dynamic mechanical stresses caused by impact and drop loading are an important concern when assessing the durability of portable, hand-held electronic products. This study focuses on failures in COTS MEMS packages on PWAs, due to repeated drop and impact events. This MEMS component uses a system-in-package (SIP) configuration, consisting of a MEMS microphone chip and an ASIC signal...
This paper presents a systematic approach to study the effect of manufacturing variables on the creation of defects and the effect of those defects on the durability of lead-free (Pb-free) solder joints. An experiment was designed to systematically vary the printing and reflow process variables in order to fabricate error-seeded test assemblies. The error-seeded samples were then inspected visually...
This paper presents a strain based fatigue model for Pb-free SAC (Sn3.9Ag0.7Cu) solder interconnects based on the results of a designed experiment. Testing consists of temperature cycling CLCC packages soldered to printed wiring board under a fixed 100degC temperature range with the mid-point temperature varying between 25 and 75degC. In addition, the dwell (hold) time at the maximum temperature is...
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