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Modern wireless communication systems employ a variety of methods to help ensure reliable data transmission in challenging environments. One method uses a channel code designed such that a given transmission can be decoded by the receiver as soon as a sufficient number of symbols is received. Such a scheme is referred to as rateless coding. Rateless codes are well known for their application to erasure...
Link adaptation is one of the key features of modern 3G and 4G communication systems, enabling a significant boost in achievable throughput. Accurate link error prediction (related to channel capacity estimation) is required for implementation of link adaptation. Practical link adaptation algorithms almost universally require extensive simulation effort. On the other hand, research based on information...
A novel air gap (AG) structure is integrated into TSV formation to achieve high performance interconnects for 3D stacking of 28nm CMOS devices. When benchmarked against conventional TSVs, the most prominent advantages of this novel TSV structure demonstrated reduced capacitance, minimized TSV-induced stress and, hence, reduced keep-out zone (KOZ) for CMOS devices. Our FEM simulation confirms that...
Non-binary low-density parity-check (LDPC) codes have been shown to attain near capacity error correcting performance in noisy wireless communication channels. It is well known that these codes require a very large number of operations per-bit to decode. This high computational complexity along with a parallel decoder structure makes graphics processing units (GPUs) an attractive platform for acceleration...
Non-binary low density parity check codes (LDPC) have been shown to outperform their binary counterparts and attain the best-known performance among error-correction codes. At the same time, it has also been established that wireless communication using multiple-input multiple-output (MIMO) schemes dramatically increases system capacity and reliability when information symbols are appropriately coded...
In this paper the influences of various pulse durations and reference cell types on CIGS thin-film PV module performance measurements with a long-pulse solar simulator are presented. Pulse duration between 50ms to 1050ms is chosen by long-pulse solar simulator in the study. The differences of module performance caused by using monolysilicon and polysilicon reference cells with/without EVA, respectively,...
In this report, a metal-semiconductor-metal varactor diodes on top of an AlGaN/GaN-based epitaxial structure is proposed to the fast surge protection application. The fabricated device's capacitance-voltage (C-V) property and surge immunity are presented. In addition, to verify its capability for slow and fast surge absorption, three protection configurations; the gas discharge arrestor (GDA) only,...
For error-correction codes, the optimal coding rate can vary and depend on factors including channel, time-varying fading, environmental interference, power, bandwidth allocation, communication content, and application. Rate adaptive coding schemes are thus important for robust communications. This writeup proposes and studies a rate adaptive low density parity check (LDPC) coding scheme using non-binary...
The goal of this study is to experimentally and numerically study the thermal and optical behaviors of flip-chip (FC) LED packages with and without underfill. For thermal characterization, the junction temperature (Tj) and thermal resistance (Rth) are evaluated experimentally by a junction temperature tester and an infrared thermal imager, and numerically by ANSYS simulation. After the simulation...
This paper proposes a velocity control approach for the light electric bike with human power and disturbance estimation. The implementation of the disturbance observer in both the open-loop and closed-loop is tuned in terms of the dc gain of a Q-filter. The torque control law assumes that the slow varying part of disturbance has been successfully estimated and compensated, and is obtained from optimal...
Using a novel replacement gate SOI FinFET device structure, we have fabricated FinFETs with fin width (DFin) of 4nm, fin pitch (FP) of 40nm, and gate length (LG) of 20nm. With this structure, we have achieved arrays of thousands of fins for DFin down to 4nm with robust yield and structural integrity. We observe performance degradation, increased variability, and VT shift as DFin is reduced. Capacitance...
Technology challenges and solutions in the development and fabrication of high-density three dimensional (3D) chip integration structures have been investigated. Critical 3D integrated circuit (IC) enabling technologies, such as through silicon via (TSV), wiring and redistribution layer (RDL), wafer thinning and handling, micro-bump (μ-bump) processes and joining, that form the building blocks for...
Flip chip technology is one of the advanced chip packaging techniques in IC packaging industry. This technology may provide a solution to enhancing heat-dissipation and optical performance of the LED when applying to the LED packaging. The goal of this study is to experimentally and numerically study the thermal performance of flip-chip (FC) LED (with the size of 1 × 1 mm) with and without underfills,...
Kepco has installed PMUs at three of its major transmission lines in 2009. An advanced algorithm, WAVI(Wide Area Voltage stability Index), has proposed in order to monitor the real-time voltage stability in metropolitan area of Korea. This paper presents a brief summary of the installation planning and provides details on results from the real-time measured data, which are obtained from those PMUs...
Wireless communication using multiple-input multiple-output (MIMO) systems improves throughput and enhances reliability for a given total transmit power. Achieving a higher data rate in MIMO systems requires utilizing an effective space-time coding and modulation scheme. The appropriate algorithm to use for a system will depend on parameters such as the number of transmit/receive antennas, target...
There are four topics have been discussed in this paper via numerical simulation which include on board placement, stand-off, redundancy design and outlet condition. The simulation is performed for 1U with 200W and 2U system with 700W, respectively. This paper also provides the some solutions for each topic and reveals the thermal phenomena in these two systems. The proper placement can reduce the...
We investigated molecular carbon (C16H10) implant as a replacement for both a monomer carbon co-implant as well as a Ge pre-amorphization step for ultra-shallow junction (USJ) formation in a p-MOSFET SDE doping process in a 40 nm logic device. Carbon is often used in the p-FET extension sequence because it reduces transient enhanced diffusion (TED) by trapping silicon interstitials. However, a Ge...
We present a fabrication process for three-dimensional (3D) microstructures using multi-step electrochemical etching of metal foils. The present process offers advantages of simple, cost-effective, and fast process with uniform and well-controlled material property. In the experimental study, we performed single-step electrochemical etching of 2D cantilever array and multi-step electrochemical etching...
Despinning the front end of a spinning flying munition is an important step towards flight control of said vehicle. A counter-rotation control scheme is proposed to despin and stabilize the front end of the vehicle at a definable still roll position with respect to earth. Classical and Hinfin control theories are employed to construct the despin controller.
In recent years, printing has received substantial interest as a technique for realizing low cost, large area electronic systems. Printing allows the use of purely additive processing, thus lowering process complexity and material usage. Coupled with the use of low-cost substrates such as plastic, metal foils, etc., it is expected that printed electronics will enable the realization of a wide range...
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