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A feasible method to extrude Cu-based alloys by a high-temperature melt-extrusion (ME) module and the property characterization of Cu-Zn alloys were conducted. The ME module assembled on 3D Printer (3DP) had different designs from traditional 3DP. The module for 3DP applications has superior characteristics, such as 1100oC-extrusion capability, high heating rate (930 oC/ 5 min), good thermal insulation,...
Due to a relatively low melting point and good formability of Na2O-SiO2-TiO2 with B2O3 (NS-TB), a glass was selected suitably applied on 3D printing (3DP) technique. As a result, a melt-extrusion (ME) module was designed and assembled to print layers of NS-TB glass directly. The ME module consisted of heating and thermal insulation devices, could reach 1100 oC at the nozzle by supplying 130 W power...
In this work we reported a new methodology for ink coating for TEM sample preparation. Detailed pre-FIB and FIB processes were performed under different conditions such as method of coating used and baking temperatures. TEM profile was taken on all prepared sample to understand the critical dimensions of PR under various conditions, and a comparison was made to conclude the best coating method to...
Silicon nanodevice biosensors have been attracted a lot of attention due to its advantages of label-free, real-time and very high sensitive detection. This study employs self-assembly monolayer (SAM) of methoxy-poly(ethyleneglycol) silane (MPEG-sil) as passivation on Si nanodevices. Ablation of SAM by Joule heating (JH) was performed at n− region of a nanobelt device, where the linker molecules, biotin...
Place a Die breaking strength is related to the surface morphology of the die. Existing of the defects on the die backside makes die fracture becomes a more severe problem in the microelectronic package. In this study, impact of the die backside defects on the stress is investigated by mechanical theories. Finite element method and 3 point bending test are used to verify the theory prediction. Thin...
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