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Heat dissipation of electronic packages has become one of the limiting factors to miniaturization. The removal of the heat generated is a critical issue in electronic packaging. With the development of thermal management, thermal interface material (TIM) plays a more and more important role in electronics packaging. A new nano-TIM with nanofibers prepared by using electrospinning has been suggested...
Thermal management in electronics packaging is becoming more rigorous with the increase of IC power. A common method is to transfer heat from the heat generating devices using a heat dissipation member, for example heat sink. Thermal interface material (TIM) is applied between the heat source component and the thermally conductive member to offer a fast heat dissipation path. Nano thermal interface...
Heat dissipation of semiconductor packages has become one of the limiting factors in miniaturization. A new Nano Thermal Interface Material (Nano-TIM) with potential high thermal conductivity and excellent mechanical properties manufactured by electrospinning process has been published earlier. In the present work, SiC nano-particles were added into the electrospinning solution to improve the thermal...
The adhesion of copper/liquid-crystalline polymer bilayer lamination structures with various thickness fabricated with chemical electroless copper deposition (CECD) and surfaced activated bonding (SAB) were characterized mechanical shear-off tests. The influence on the surface morphology and chemical state during different processes, including sulfuric acid bath, heat treatments, plasma treatments...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
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