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Isotropic conductive adhesives (ICAs) are a type of interconnect material used more and more widely in computer, robot, mobile phone, LED and so on. Compared with traditional solders, isotropic conductive adhesives have better working plasticity, creep resistance and heat resistance. In particular, isotropic conductive adhesives are more responsive in high density packaging than solder, which determines...
This paper provides a comprehensive review of the recent progress of research work performed to develop new thermal interface materials. The review starts by classifying existing thermal interface materials and analyzing their advantages and disadvantages. The state of the art research is then reviewed with an emphasis on those materials based on various carbon allotropes, such as graphite, carbon...
The need for faster, smaller, and more reliable and efficient products has resulted in increase of heat generated in microelectronic components. The removal of the heat generated is an important issue in electronic packaging. The present research work aims at developing a new class of nano-thermal interface material (nanoTIM) that has low thermal resistance, high thermal conductivity and mechanical...
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