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A method to fabricate complex structures on non-planar surfaces by utilizing a transfer method is presented. 3-dimensional and high-aspect-ratio microelectromechanical systems (MEMS) structures are transferred to flexible membranes, and can be further transferred to any non-planar surfaces. Here, we used a structure formed on a silicon-on-insulator (SOI) wafer by deep reactive-ion etching (DRIE) as...
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