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On one hand, with the rapid increase of integrated circuits (ICs) I/O number, the traditional package technique does not meet the need of pioneer development. On the other hand, three-dimensional integrated circuits (3-D ICs) become more and more popular to satisfy the multi-function chip development. One of the best solutions of these needs is the ultra-fine pitch micro-bumps. The micro-bumps can...
In this study, we would analyzed the solid state reaction between Sn2.5Ag solder bump and Cu/Ni under-bump-metallization (UBM). After 150°C thermal aging, we observed that the intermetallic compounds (IMCs) at chip side and interposer side both were Ni3Sn4 IMCs. It indicated that the solder did not react with Cu and the Cu layer was completed. As thermal aging time increased, the thickness of Ni3Sn...
For the feature of "slim and light" in portable devices, stacked 3D-IC architecture was introduced in the advanced packaging techniques. The traditional FR-4 substrate was substituted by Si substrates. In general, the thickness of Si chip and substrates would be larger than 300 micron. However, silicon is rigid and has high resistance of deformation. Therefore, the thermal stress caused...
In this study, we study the metallurgical reactions at liquid state for different thickness Sn2.5Ag solder microbumps with Cu/Ni UBM. After 260°C reflow, we observed that the intermetallic compounds (IMCs) at chip side and interposer side both were Ni3Sn4 IMCs. As reflow time increased, the thickness of Ni3Sn4 IMCs and the concentration of Ag in the solder increased. We calculated the Ni3Sn4 IMCs...
The ultra fine pitch micro bump became the future trend due to the development of 3D IC. In this research, three-dimensional simulation was employed to examine the temperature distribution in micro SnAg solder bumps. According to the result, the temperature distribution in solder bump of micro bump is nearly uniform. In addition, the hot side is near the substrate side, whereas the cold side is near...
It is well known that Ni and its alloys possess a lower reaction rate with Sn than Cu and Cu alloys. Therefore Ni-based under bump metallization have attracted attention in recent years. In this study, the diffusion-controlled reaction between eutectic Sn-3.5Ag flip chip solder joints between electroplated-Ni (EP-Ni) and electroless-Ni (EL-Ni) has been investigated. Morphology and growth kinetics...
With the portable devices becoming smaller and more compact in size, flip-chip technology has been adopted for fine-pitch packaging in microelectronics industry. Area array of tiny solder joints can be fabricated on Si chips to achieve high-density packaging. In addition, as the required performance continues to increase, the input/output (I/O) pin count of flip-chip products has dramatically increased...
We have developed an easy, low-cost, and low-temperature optoelectronic hermetic packaging technology utilizing the eutectic SnPb solder and the Cr/Ni/Cu bonding pad. Bonding characteristics of the design were investigated in three different setups: silicon-silicon, silicon-glass, and glass-glass samples. Hermeticity was achieved at 200 degC without flux for all samples during the final bonding process...
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