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We have developed and employed an automated multi-scale modeling approach to investigate thermal issues in analog integrated circuits (ICs) and to enable ldquothermally awarerdquo design thereof. Thermal analysis from full-chip scale down to the single transistor level was made possible with this approach utilizing the finite volume three-dimensional (3D) numerical technique. We have developed new...
A multi-scale modeling approach is proposed and employed to investigate thermal issues and to enable "thermally aware" design of radio-frequency (RF) integrated circuits (ICs). Thermal analysis from full-chip scale down to the single transistor level was made possible with the development of this approach using the finite volume three-dimensional (3D) numerical technique. We have developed...
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