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A method to fabricate complex structures on non-planar surfaces by utilizing a transfer method is presented. 3-dimensional and high-aspect-ratio microelectromechanical systems (MEMS) structures are transferred to flexible membranes, and can be further transferred to any non-planar surfaces. Here, we used a structure formed on a silicon-on-insulator (SOI) wafer by deep reactive-ion etching (DRIE) as...
This paper presents high performance Al pastes for n-type solar cells with p-type backside. These pastes were screen printed and subsequently fired in a belt furnace to form rear-Al emitters. Internal Quantum Efficiency (IQE), and full I-V curve characterization and curve fitting to investigate leakage currents were carried out to study the effect of glass frits, additives and firing profiles. The...
The advances of semiconductor technology are mainly due to the advances of polymeric materials. These include the use of polymers as adhesives (both conductive and non-conductive), interlayer dielectrics (low-k, low loss dielectrics), encapsulants (discrete and wafer level packaging), embedded passives (high-k and high-Q materials), superhydrophobic self-cleaning lotus effect surfaces, and etc. In...
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