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Polyoxometalate nanostructures have attracted extensive interests due to the significant technical demands such as catalysts, sensors and smart windows. Thus, researchers have developed many methods for synthesis of these nanomaterials in the recent years. However, those techniques have many visible flaws, e.g. high temperature or high pressure environment, various templates or additives, demanding...
3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5μm space/5μm width) single and dual damascene processes...
3D integration by TSV approach is a very hot topic now as an enabling technology for 3D wafer-level packaging and 3D IC. Re-distribution layer (RDL) process becomes more critical on high volume Cu (TSV) wafer because of Cu thermal stress effect. Fine pitch low temperature RDL is required in 3D packaging and 3D IC integration. We develop fine pitch (5µm space/5µm width) single and dual damascene processes...
Soil degradation and retrogression have been widely concerned in China in the last several decades due to inadequate utilization, application of various agrochemicals and pesticides, soil pollution, rapid urbanization, and frequent human activities. Degradation of agricultural soils may not only result in some health risks to soil ecosystems, but also affect food quality and safety. This study was...
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