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The surface roughness in silicon direct bonding is investigated based on the contact theory of a flat plate. Two silicon wafers with the same surface roughness in a Gaussian distribution are modeled as two different surfaces in contact. One surface is a rigid flat surface, and the other is a surface having a combined Gaussian-distributed roughness. The relations among the elastic stress due to surface...
A novel hermetic wafer level packaging technology is presented in this paper, which was realized by the aid of low temperature direct bonding. One silicon wafer with etched cavities and the other bare wafer, which acted as cover and substrate respectively, were bonded to demonstrate the feasibility of this technology. The bonding surfaces of both wafers were activated hydrophilically by a series of...
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