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This work is devoted to characterization of the deformation and strength properties of cataclastic sandstones. Before conducting mechanical tests, the physical properties were first examined. These sandstones are characterized by a loose damaged microstructure and poorly cemented contacts. Then, a series of mechanical tests including hydrostatic, uniaxial, and triaxial compression tests were performed...
Within the next three years, it is likely that the interconnection pitch of the advanced flip chip will come down to 100 micron. In order to study the solder joint reliability more efficiently, a slim sector model has been developed to handle the large number of interconnects involved (Zhao and Tay, 2003). The number of nodes and elements of the slim sector model is much lesser than that of the traditional...
With the relentless trend in ever-increasing number of I/Os on packages and the decreasing pitch of interconnects on packages, the task of modeling the fatigue life of the interconnects is becoming evermore challenging. This paper presents a RVE hybrid slim sector model which could be employed to meet the challenge. In this model, almost all the interconnects between chip and substrate are replaced...
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