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Handheld consumer electronics are requiring more complex packaging designs to accommodate higher component densities and reduce form factor. Fan-out wafer-level packaging (FOWLP) has garnered much attention lately as a cost-effective way to achieve high interconnect density and manage larger I/O counts within an affordable package. Two principal approaches to manufacturing FOWLP components have evolved:...
Over the past few years, temporary bonding has spread together with the development of 3D stacked IC (SIC) technology. Maturity of the various processes has constantly improved. Early processes enabled first demonstration of circuit thinning and thin wafer debonding. Each material generation has brought a step function in the technology maturity, which is now reaching a level allowing first 3D-SIC...
A simple but effective common-mode noise suppression filter using cavity-backed defected ground structure (DGS) is proposed for the application of multilayer printed circuit board (PCB). This filter adds a substrate-filled metallic cavity beneath a conventional DGS. Due to the shielding effect of the cavity, the back-radiation of the DGS can be significantly reduced, while the filtering behavior of...
Survivable virtual network mapping (SVNM) has been extensively investigated to guarantee that the mapped virtual network (VN) works normally against substrate failures. The existing studies of SVNM mainly focus on single node or single link failure. Since natural disasters usually cause severe substrate failures in geographic regions, some work addressing SVNM against regional failures has been studied...
Through silicon vias (TSV) are critical vertical interconnects in 3D IC. We comparatively studied the signal integrity of different designs of TSVs both existing and new in a single die up to 20 GHz. For TSVs in multiple die stacking, we proposed to use the cascaded scattering matrix approach for their signal integrity analysis. The results are validated against those from full-path simulation. Compared...
After spinal cord injury, electrical stimulation of the roots inside the spinal column at the level of the cauda equina is a safe and effective way to regain some degree of control over lower body function, e.g. bladder and bowel management and leg movement. The success of current systems used for so-called intrathecal stimulation is limited by the low number of stimulation channels, which are in...
A novel method based on hybrid integral equation for electromagnetic emission and susceptibility modeling of power-ground planes with a finite size is proposed in this paper. First, the entire computational domain is divided into the internal subdomain including the substrate sandwiched between the power and ground planes and the external subdomain surrounding the power-ground planes. The internal...
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