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The surface electric and magnetic susceptibilities and the surface impedance of an array composed of periodic scatterers are derived based on generalized sheet transition conditions. Using these characteristic parameters, the reflection coefficient of a reflectarray element can be readily computed for arbitrary incident angles, polarizations, and frequencies. The detailed procedure is described and...
This paper presents a study on the design guidelines for the common-mode filters with cavity-backed dumbbell-shaped defected ground structures (CB-DB-DGSs). An equivalent circuit model was first developed to explain the physical insight of the CB-DB-DGS common-mode filter. With the help of the equivalent circuit model, the design parameters of the DGS and the frequency behavior of the filter are correlated...
A new equivalent circuit model is presented for modeling a differential pair of through-hole vias in multilayered electronic packages. The differential pair of through-hole vias, which share same anti-pad clearance, is analyzed and an equivalent circuit model for the differential vias is analytically derived from the electro- and magneto-quasi-static relations of the E and H fields along with the...
Multi-physics modeling offers rich opportunities for studying the properties of through-silicon vias (TSV). Results of a TSV study with the theories of electromagnetics, semiconductor physics, and thermal physics are presented. Equivalent circuit models are used to draw together the three different theories to perform the TSV modeling. Moreover, a single TSV is examined for high-speed signal transmission...
This paper presents an accurate compact scalable RLCG (Resistance, Inductance, Capacitance, and Conductance) model for electrical modeling of through-silicon vias in 3D IC packaging. Closed-form formulas for R and L are derived by full-wave approach, while C and G are taken from static solutions. The equivalent circuit model can capture almost all the parasitic effects, such as skin, proximity and...
In this paper, we propose a novel field-circuit method for the signal and power integrities simulation of power distribution networks. The electromagnetic field inside the power distribution network is expressed in the modal field distribution. The modal field is then decomposed into the parallel plate mode and transmission mode, which are related to the power-ground planes and signal traces respectively...
This paper studied the problem of coupled electrical and thermal modeling, specifically for the signal integrity analysis of on-chip interconnect due to the influence of substrate and interconnect temperature. The approach presented in this paper is using finite-difference method (FDM) to solve for the temperature profile of the substrate. The information of the substrate temperature is used for subsequent...
A novel dual-band band-pass filter and a novel dual-band 1:3 series power divider are presented here, both the elements utilize the concept of composite right/left handed transmission lines (CRLH-TLs). The filter operates at 1.5GHz and 2.3 GHz, with fractional bandwidths of W1 =10.2% and W2 =13.0%, respectively. The divider is designed to operate at 1.14 GHz and 2.47 GHz, over the two frequency bands,...
This paper presents a novel algorithm for EMC simulation of electronic package integration. This algorithm is based on hybridizing method of moments with analytical method, modal expansion technique. The entire electronic package domain is divided into two networks: the signal distribution network and the power distribution network. The signal distribution network is simulated using the method of...
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