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Current crowding of a micro spring pressure contact under high current is studied. The spring conducts >; 250 mA electrical current between chips, has large mechanical compliance (>; 30 μm) compared to other packaging technologies, and fits in a 180 μm pitch 2d array. At 250 mA and 65°C, daisy chains of 134 spring contacts in a silicon package show stable resistances and hot spot temperature...
3D p-n junction is a new kind of detector, also suggested as energy conversion device which can be adopted in high energy physics, clean energy power source and material test. The electrochemical etching process utilizing anodization has been described as a recommendable method to fabricate 3D structure for p-n junction. However, the thickness of sidewall between two adjacent pores in the structure...
Various silicon-based microchannels with different internal surface morphology is investigated to grow CNTs (carbon nanotubes) on the surface of the pore wall which may enhance the electron emission. The morphology of the samples prepared under different conditions is determined by scanning electron microscopy (SEM). Parameters such as temperature, concentration of hydrofluoric acid, potential, current...
Silicon microchannel plates have been explored intensively for numerous applications especially for ultraviolet image detection. The electrochemical etching in hydrofluoric acid-based solutions is known as a technique for porous silicon formation. The function of backside illumination and temperature in the electrochemical etching of large-size and high aspect ratio silicon microchannels plates has...
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