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This study presents a method to use copper nodules to induce dielectrophoresis force. It can be applied in biomedical cell capture. The capture electrode is a 3D interdigitated microelectrode and also can be used in electrical cell impedance measurement. No additional procedural is needed to form copper nodules. The process is easy, convenient, and the same as a normal 3D electrode manufacture.
During the R&D of advanced nanometer CMOS technologies such as 20nm and beyond, we implemented in-house 3-D capacitance extraction software to provide R&D engineers with an accurate modeling tool to optimize the complex 3-D nanometer dimensions and materials that may be used for competitive CMOS devices in terms of power consumption, performance, and area. Our extractor solves 3-D Laplace's...
This paper proposes a method for optimized the Unmanned Surface Vehicle (USV) structure based on a combination of iSIGHT optimization software and the parameterized model of geometry and finite element. The finite element model of the vehicle was established by using the parameterize language (ANSYS Parametric Design Language) of ANSYS based on the study of the material of the USV hull. And then the...
This paper studies the structural design and analysis of a precision nono-positioning planar motion stage. First, the configuration design and specification of the planar motion stage are proposed. The stage consists of a stage base, a carriage supported by four air bearings, four linear motors, and a two-dimensional optical encoder. The planar motion stage has characteristics of high precision, long...
Investigating the displacement motion of the piezoelectric ultrasonic transducers plays an important role for bonding process in package technology. Mechanical vibration and electrical performance analysis of the transducer is a great concern. The commercial 3D ATILA software is used for simulation first. Best resonance frequency of the transducer is verified and tested via LCR impedance meter and...
The thermosonic flip-chip bonding technology operates in lower temperature, bonding force, and less bonding time than wire bonding. Improving the bonding efficiency of ultrasonic transducers plays an important role for bettering bonding process in gold-to-gold interfaces. Analysis of the transducer tool both in mechanical vibration and electrical performance is great concern. The commercial package...
In this paper, a redesign of the prestress mechanism of the stack-type piezoelectric ceramic actuator is provided. Belleville (disc) springs which have a specific height-to- thickness ratio are constructed to generate a constant pre-stress force to the PZT and operated in a special condition. The zero- spring-rate preload mechanism is not only used to handle the tensile stress but also used in both...
In this paper, a novel redesign of the prestress mechanism of the stack-type piezoelectric ceramic actuator is provided. Belleville (disc) springs which have a specific height-to-thickness ratio are constructed to generate a constant pre-stress force to the PZT and operated in a special condition. The prestress mechanism is not only used to against the tensile stress but also used to improve the output...
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