The Infona portal uses cookies, i.e. strings of text saved by a browser on the user's device. The portal can access those files and use them to remember the user's data, such as their chosen settings (screen view, interface language, etc.), or their login data. By using the Infona portal the user accepts automatic saving and using this information for portal operation purposes. More information on the subject can be found in the Privacy Policy and Terms of Service. By closing this window the user confirms that they have read the information on cookie usage, and they accept the privacy policy and the way cookies are used by the portal. You can change the cookie settings in your browser.
This paper presents the impact of Through Silicon Via (TSV) process on wafer level reliability with respect to front-end of line (FEOL) and back-end of line (BEOL) reliability aspects. A TSV proximity study was performed by placing the TSV at various keep-out zone (KOZ) distances and different orientations of horizontal, vertical, and 45 degrees. FEOL and BEOL test structures were designed using stand-alone...
The impact of wafer level reliability of TSV has been studied with respect to FEOL (Front End of Line) and BEOL (Back End of Line) reliability aspects. A TSV keep out zone (KOZ) study has been done with varying gate length and width of transistor. Gate voltage (Vg) vs saturation current (Idsat) plots show that there is negligible impact on Idsat due to mechanical stress of the TSV for
For the first time, a near-Zero Keep Out Zone TSV capability is demonstrated utilizing the Middle Of Line (MoL) layer stack process development and optimization. This is MoL layer stack consisted of a nitride, PMD oxide, and contact protection layer. Careful selection of a high CTE Contact Protection layer to compensate the TSV induced stress in Silicon (Silicon CTE is 2.3ppm/°C) yields the near-Zero...
Set the date range to filter the displayed results. You can set a starting date, ending date or both. You can enter the dates manually or choose them from the calendar.