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Chip scale package (CSP) as an advanced technology has been applied to LED lighting devices, besides electromigration (EM) in CSP under high current density has become a critical reliability issue for the future high density microelectronic packaging. In this paper, the thermal-electric-mechanical coupled analysis is performed by the flip-chip CSP LED multi-physical finite element model. Based on...
As the demand of power converter for higher power density is increasing, bonding wire failure of IGBT module becomes more severe. Accordingly, it is of great significance to investigate the reliability of bonding wire under operating condition for improving the reliability of IGBT module. In this paper, the finite element model of IGBT module was established, and a two-step indirect coupling electro-thermal-mechanical...
Vibration reliability test for plastic ball grid array solder joints have been developed by performing vibration tests with constant G-level input excitation. A specially designed PBGA assembly with built-in daisy chain circuits was mounted on a printed circuit board as the test vehicle. The test vehicle was mounted on vibration shaker by four standoffs at the corner of the board. It was then excited...
Thermal cycling reliability test and finite element analysis have been conducted for plastic ball grid array assembly with Sn63Pb37 solder. Based on the thermal cycling test results, a two-parameter Weibull distribution model was used to determine the characteristic time to failure of plastic ball grid array assembly. Besides, cross-sectioning and optical microscope examination were utilized to identify...
As the demand expanding for high electrical performance, high pin count and low cost, the copper pillar bump packaging has been extensively used in recent years. However, the drawback is that copper pillar bump can introduce high stress, especially on low-k chip. In this paper, finite element method was adopted to optimize the structure of copper pillar bump, aiming at relieving the stress of low-k...
The thermal-mechanical reliability of the flip-chip with copper pillar bump is analyzed through finite element numerical simulation and Kriging response surface models optimization method. The results show that: the successive order of factors affecting the chip warpage is: die thickness, bump pitch, die thickness, substrate thickness, Cu Pillar height, Cu Pillar height, PI thickness, PI opening size;...
Just in few years, three-dimensional (3D) packaging technologies have attracted much more attention. With emergence of through-silicon via (TSV) technology, silicon-based device integrations, the TSV's, have become the main stream of 3D packaging technologies. TSV's can be further classified as 2.5D and 3D TSV's. For 2.5D TSV package assembly, since multiple components involved, there are normally...
Thermal management for package assembly, especially for high power packages, is very important to the reliability and quality of electrical products. In this paper, a finite element approach is proposed to investigate the thermal performance of TO252-5L(B) package attached on printed circuit board(PCB) with different layers and sizes, which is further related to reliability issue of this type of IC...
Through Silicon Via (TSV) has emerged as a good solution to provide high density interconnections in three-dimensional packaging interconnect technologies. However, the thermal-mechanical reliability is a big issue. When the TSV is subjected to thermal load, large stress and strain would be created at the interface of the materials because of the great mismatch of CTE. In this paper, an axi-symmetric...
In this study, the board level solder joint reliability analysis and fatigue life prediction of dual-row QFN package are carried out. The effects of solder constitutive model and finite element (FE) model on solder fatigue life are studied. Three different constitutive models of SnAgCu lead-free solder including viscoplastic Anand model, steady-state creep hyperbolic sine model and double power law...
Interfacial delamination between molding compound (MC) and die pad interface is the most crucial failure mechanism of exposed pad package under reliability testing due to high interfacial stress and weak adhesion strength. A combined interfacial adhesion characterization, JEDEC Moisture Sensitivity Level 3 and 3X IR reflows qualification and testing, finite element analysis as well as finite element...
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