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An electroless chemical etching technique using polystyrene nanospheres as self-assembled mask is developed to fabricate size-controllable, periodic silicon nanopillars (NPs) and subsequent nanocones (NCs) arrays. The Si NCs are obtained based on the NPs structure using cost-effective ammonia-related etching chemistry. The diameter, height, and periodicity of the NCs can be systematically controlled...
We have developed a MEMS probe-card technology for wafer-level testing ICs with 1-D line-arrayed or 2-D area-arrayed dense pads layouts. With a novel metal MEMS fabrication technique, an area-arrayed tip matrix is realized with an ultradense tip pitch of 90 mum times196 mum for testing 2-D pad layout, and a 50-mum minimum pitch is also achieved in line-arrayed probe cards for testing line-on-center...
Metal MEMS structures can be formed by metal electroplating with the aid of thick-photoresist molds. The microfabrication features low-temperature process that is post-CMOS compatible and can be used for on-chip integration of high-performance RF parrives for RFICs. On the other hand, The plating process can be combined with silicon micromachining techniques to build operation tools, like probe-cards,...
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